EcoClean

Elegant, cost-effective, small, and incredibly capable, the EcoClean offers the capability of leading-edge front-end semiconductor systems at a fraction of the size and cost of competitors. Create advanced solutions for current and next-generation technologies with this perfect “sweet-spot” system for the emerging “More than Moore” processing requirements of MEMS, Power, LED, Micro LED, RF, sensors, and biotech.

High-Density Plasma

YES EcoClean systems use oxygen and nitrogen atoms created in high-density plasma for cleaning/stripping rather than the gallons of toxic chemicals and water required by wet cleaning systems. By using a downstream resist strip process, EcoClean systems achieve a high removal rate with no electrical damage or defects to substrates.

Our remote source produces a high-density plasma with the advantage of confining charged plasma species within the plasma chamber, ensuring that only charge-neutral species flow from the source and interact with the substrate. The end results are much higher throughput with low gas utilization, lower capital costs, and a safer, greener automated process.

FEATURES

• Downstream plasma and distributor
• Small footprint with single chamber (<0.75 m²)
• Highly reactive neutral species
• Elegant system with only 3 moving parts
• Controlled O, H and F species
• State of the art parts – readily accessible
• R&D to high-volume production with minimal downtime
• Flexible wafer size: 2” to 8”
• Low gas usage

BENEFITS

• High strip/descum rate – 100-100,000 Å/min (0.01 – 10 um/min)
• High throughput – up to 65 wph process
• 2x lower CoO and ½ the footprint
• No defects or damage due to ICP downstream plasma
• High reliability with >95% uptime
• Eco-friendly “green” process

APPLICATIONS

• Photoresist removal
• PR descum
• Polyimide removal
• Organics removal
• Copper oxide removal

SECTORS

• Advanced Packaging
• MEMS
• Compound Semiconductor (LED, uLED)
• Power Devices
• Sensors
• Biotech and Bio-sensors devices