Ultra-high resolution field emission SEM can achieve a magnification of up to 200K to 300K times, placing more demanding requirements on the particle size of spray-coated metals. Conventional Pt or Pt-Pd alloy schemes are no longer sufficient to meet these requirements adequately, and higher melting point Ir targets are too expensive. Therefore, high melting point metals such as W and Cr with smaller particle sizes are highly favored. However, due to their active chemical properties, W and Cr require higher vacuum conditions for sputter coating.
To address this, we have designed a dual vacuum mode dual-target ion sputter coater. This design takes into account the timeliness and convenience of low vacuum mode spray coating with inert metals such as Pt or Au. It can also introduce Ar gas for coating W, Cr, Ag, Ti, Cu, C, and other easily oxidizable materials in high vacuum mode. Moreover, it can achieve alloy film spray coating using unique layering or co-sputtering modes, resulting in higher compatibility with various SEM sample preparation scenarios.
Dual vacuum mode
Dual target design
Rotary-tilting sample stage
High Vacuum Mode: Ultimate vacuum degree less than 10^-3 Pa.
Low Vacuum Mode: Fast and convenient.
No need to change target materials.
Any component alloy sputtering.
Unique layered sputtering process.
Revolution + Rotation + Tilting.
Z-axis height adjustable, flexible for different height sample coating.
Materials that can be deposited:
Precious metals such as Pt, Au, Pd, and Ir.
High melting point and easily oxidizable target materials such as W, Cr, and C.
Monometallic or alloy materials such as Ag, Ti, and Cu.
Key Features
Dual vacuum coating mode: High flexibility and convenience of use.
Dual-target magnetron sputtering cathode: No need to change targets, utilizing a unique layered sputtering process.
Digital rotary-tilting sample stage: Facilitates 3D sample deposition.