A simple, economical and repeatable process for photoresist coatings in photolithography wafer processing with fine control of flow rate, coating speed, and deposition amount using an advanced layering technique.
Uniform thin film coverage of various surface profiles.
Capable of coating high aspect ratio trenches with excellent uniformity.
Non-clogging atomized spray.
Ability to deposit thin single micron layers with high uniformity.
Repeatable proven spray process.
Basic Specifications
DIMENSIONS: 1066mm W x 1765 mm H x 1095 mm D (42” W x 70” H x 43” D)
WORK AREA: 465 mm x 465 mm x 100 mm (19.7” x 19.7” x 3.9”)
CONTROL: Windows-based (pc included 19-inch touch screen interface)
POWER REQUIREMENTS: 208-240VACc, 16A max, 50/60 Hz 1 phase (L,N,G) or (L1, L2, G)