VertaCure

YES-VertaCure is a production-proven automated vacuum cure system, equipped with 5-zone uniform temperature control and laminar gas flow. This system provides excellent film performance, much higher throughput and lower CoO than atmospheric curing, and delivers superior mechanical, thermal and electrical properties for a large variety of polymers for wafer-level packaging (WLP) applications. YES-VertaCure also provides superior wafer-to-wafer (WtW) and die-to-wafer (DtW) bonding anneal.

Unparalleled Innovation

Production-proven Excellence

Utilizing YES’s patented vacuum cure process, the VertaCure offers shorter cure time, excellent temperature uniformity and high uptime for high volume manufacturing (HVM).

Chamber Exhaust Condensate Trap

Protect vacuum lines, valves, and vacuum pump performance from the accumulation of solvent condensates during the cure process. Easily dispose of the condensates.

Laminar Flow Technology

The VertaCure ensures laminar flow of gas (parallel to the wafers) to eliminate gas turbulence, resulting in excellent temperature uniformity and industry-leading particle performance.

FEATURES

• 5-zone temperature control with < 1.0% uniformity
• Laminar flow for industry-leading particle performance
• Oxygen-free environment (<10ppm)
• Active heating and cooling for controllable ramp-up and ramp-down
• Simultaneous processing of 50 – 100 wafers per batch
• 300mm, 200mm or 200mm/300mm bridge capability
• Wafer-handling robot inside an integrated Class 1 mini-environment

BENEFITS

• Excellent film mechanical, thermal and electrical properties
• Superior film stress and shrinkage performance
• Fewer defects than atmospheric cure
• Shorter cure time enables up to 60% higher throughput than atmospheric cure
• 2 – 3x lower cost of ownership and >95% uptime
• with short preventive maintenance (PM)
• ~ 2x less power and N? consumption
• More complete cure (5x less outgassing)
• Low wafer warpage

APPLICATIONS

• Polyimide, PBO (polybenzoxazoles) and epoxy cure
• Low temp polymer cure
• Wafer-to wafer (WtW) bonding anneal
• Copper anneal

SECTORS

• Advanced Packaging
• CMOS Image Sensor
• Fan-out Wafer Level Packaging (FOWLP)
• Semiconductor Front-end Anneal and Degas
• RF Devices