R&D Plasma Cleaning System
The G1000 offers four shelves. This parallel capacitive system excels in plasma cleaning, stripping, and surface modification in 40 kHz or 13.56 MHz. Choose from five plasma modes. Anisotropic modes include RIE and active ion trap; isotropic modes include downstream (electron free), active and downstream ion trap.
Effective and proven way to eliminate surface contaminants as well as deliver surface cleaning and surface activation. Replace toxic chemicals with eco-friendly plasma cleaning. Flexible plasma modes in low-pressure environment allow users to configure solutions for current and future applications, including pre wire-bond cleaning, flip chip underfill cleaning, biotech substrate cleaning or any general contamination removal.
FEATURES
RF plasma with 40 kHz or 13.56 MHz
Low pressure environment
Five different plasma modes: downstream to aggressive plasma
Temperature monitor
Three gas inputs (O?, Ar or N? plasma)
Four 406mm x 406mm standard sample trays (1851.6mm²)
Glass slides or glass slide tray
Gas inputs can include more esoteric gases such as forming gas, CF4 and SF6
BENEFITS
Gentle molecular level cleaning
Clean, repeatable process
No solvent residues
Surface activation
Safe and reliable energy
APPLICATIONS
Wirebond cleaning
Encapsulate cleaning
Flip chip underfill cleaning
Glass or flexible substrate cleaning for Biotech and Life Sciences application